India’s Tata Electronics starts to export chips
Cette publication existe aussi en Français
Tata Electronics Ltd. – a subsidiary of the Indian steel to automobile conglomerate – has started to export chips packaged at a pilot line in Bengaluru, according to the Economic Times.
The move marks a key step as Tata plans to develop a high-volume wafer fab in Dholera, Gujurat and a complementary packaging factory in Morigaon in Assam (see Tata, Powerchip win OK for US$11 billion Indian wafer fab). The company is expected to enjoy 70 percent subsidy support from the Indian authorities for its attempt to break into the semiconductor industry.
The factories are expected to be in production by 2026 but it would appear Tata is using its pilot capability to develop best practises for co-design, component handing and marking and for customer development.
“Tata Electronics has packaged chips there which they are sending to customers right now outside the country. They have multiple partners and are expanding their customer base. Some of these (products) are still in the pilot stage,” ET quoted one of its unnamed sources saying.
The types of chips exported was not disclosed, nor from where the wafers were sourced, which is likely to have been from outside India. The chips are reportedly generic standard products that can be used in multiple products. A power transistor or small signal transistor would be obvious candidates.
The packaged components have been shipped to Tata customers in Japan, the US and Europe, ET reported. ET also reported that Tata was close to taping out its own chip designs targeting 28nm and higher nodes.
The Dholera fab is being developed in collaboration with Powerchip Semiconductor Manufacturing Corporation (PSMC) of Taiwan at cost of about 910 billion rupees (about US$11 billion).
With a manufacturing capacity of up to 50,000 wafers per month the fab is expected to provide power management ICs, display drivers, microcontrollers (MCUs) and high-performance computing logic in support of automotive, computing and data storage, wireless communication and artificial intelligence applications.
Tata Electronics’ OSAT facility in Assam is being developed at an investment outlay of 270 billion rupees (about US$3.25 billion) and is expected to support wire-bond, flip-chip, and integrated systems packaging (ISP).
Related links and articles:
News articles:
Tata’s Indian fab to produce silicon in 2026, say reports
Tata, Powerchip win OK for US$11 billion Indian wafer fab
Tower proposes US$8 billion Indian wafer fab, says report
Micron breaks ground on US$2.75 billion Indian chip packaging fab
If you enjoyed this article, you will like the following ones: don't miss them by subscribing to :
